iWave Systems FPGA Heat Sinks for SOMs are designed for the FPGA SOMs Arria10 and Zynq Ultrascale+ MPSOC. The FPGA Heat Sinks are available in a 95mm x 75mm package made up of aluminium material. The devices have a silicone elastomer as a thermal gap pad between the CPU and the heat sink. The rugged and light weight heat sinks can be easily attached with the iWave’s FPGA system on modules.
Features:
- 95mm x 75mm Package
- Aluminium material
- Silicone elastomer as a thermal gap pad
- Rugged and light weight
- Mounting Style: Screw
- Fin Style: Forged Fin
Documents:
Heatsink (Arria10 Package)
- יצרן: SparkFun
- קוד מוצר: OR-7080 / PRT-17017
- זמינות: במלאי
-
₪396.0
- לפני מע"מ: ₪338.5
תגים: Heatsink (Arria10 Package), OR-7080 / PRT-17017, SparkFun, Heat/Cold, גוף קירור, רכיבי הגנה, רכיבי אלקטרוניקה