iWave Systems FPGA Heat Sinks for SOMs are designed for the FPGA SOMs Arria10 and Zynq Ultrascale+ MPSOC. The FPGA Heat Sinks are available in a 95mm x 75mm package made up of aluminium material. The devices have a silicone elastomer as a thermal gap pad between the CPU and the heat sink. The rugged and light weight heat sinks can be easily attached with the iWave’s FPGA system on modules.

Features:

• 95mm x 75mm Package
• Aluminium material
• Silicone elastomer as a thermal gap pad
• Rugged and light weight
• Mounting Style: Screw
• Fin Style: Forged Fin

Documents:

• Datasheet